DICOM owns an advanced SMT line for the mounting of printed circuit boards using surface mount technology. The line is conceived as a modular workplace that can mount several board types simultaneously using various technological procedures.

The technology is based on mounting SMD components in a solder paste spread on contact pads by dispenser, or screen printing with subsequent re-melting in a reflow oven with full convection or infrared heating. Boards can be mounted on one or both sides by pure or mixed mounting.

The first, manual section of the line consists of semi-automats, a repair and inspection workstation.

Prototypes, small series of boards and components unsuitable for automatic mounting are mounted on semi-automats with a Fritsch, types SM 902 and FP 904 with PC support. The device is programmed through a conversion program directly from the Protel design system.

The repair workstation is equipped with a JBC soldering station, suitable for repairing a wide range of parts using special fixtures for individual case types. For repairing and independent mounting of BGA cases we use  a Pace workstation, type TF 2000, with an optical prism, hot-air tube with replaceable nozzles and temperature/soldering time regulator.

The inspection workstation is equipped with an optical microscope by Mantis, a Mirtec MV-2HL automatic optical inspection device and an XR 3000 table-mounted X-ray device by Pace. 100% inspection of soldered connections on each board after the surface mount is performed on these devices.

The second, automatic section of the line is equipped with a mounting automats and screen printer for the spreading of soldering paste.

The mounting automat by Mydata, type MY15 and MY100 are equipped with an optical and mechanical centring, Linux operation system and intelligent feeders. The practical mounting rate is up to 8000 components per hour. A Speedprint, type SP200 screen printing device and DEK Horizon 03i with a visual system are used to apply soldering paste on substrate contact pads via polyester screens or metal strips.

The third, final section of the line consists of two reflow ovens for re-melting the solder and a washing unit for printed circuit boards after soldering.

A Pyramax 98A full convection reflow oven by BTU provides 14 heating zones with air temperature/pressure regulation and a chain conveyor with central support. The other reflow oven, a Essemtec, RO 400, with infra heating, provides 6 heating zones with ceramic radiators and a grid conveyor. The temperature profile in reflow ovens is selected via a Datapaq measuring device with six thermocouples.

We do not use wash-free technology in the manufacturing process and this is why we clean all boards after both SMT and through-hole mounting with a PBT Uniclean washing machine, using three-stage washing (washing agent, rinsing and drying). The unit is equipped with six compressed air agitation and ultrasonic baths. SMT mounting uses a solvent-based washing agent, while through-hole mounting uses a detergent-based washing agent. Rinsing is done with demi water.

Another final technology we use is the silk screening of product part top sides using manual silk screening on a PBT Uniprint or sealed ink cup pad printing, located in this section of production.

After the surface mount and subsequent inspection, the boards are transported in antistatic carriers to the through-hole mounting workstation, where output parts are mounted and soldered manually.