Placement of printed circuit boards single or double sided:

• placement of SMD components
• placement of through-hole components

• assembly of electronic device
• assembly of electronic sub-assemblies, including final measuring
• measuring and testing of AF and RF circuits
• seasoning of products from -60 °C to +80 °C

Cooperation

We offer free capacity of our SMT line to external customers:

• placement of prototype PCB
• placement of PCB for small-series and mid-series production
• placement and repairing of BGA cases
• examination of placed BGA cases on X- RAY unit
• automatic optical inspection of mounted boards
• complementary services:
  • arranging of PCB production by our cooperation partners
  • arranging of production of polyester screens and metal strips
  • new technologies
  • technical and technological consulting

Contact person: Miroslav Vlčnovský, OBO officer
tel.: +420 572 522 491