Contemporary boards are repaired in substantially different ways than boards mounted with lead-equipped components. This is why several principles must be followed to avoid damaging components, contact pads and the substrate. Workstation configuration partially depends on the type of production, its volume, degree of automation and components used.

Our company manufactures a wide range of products in small series. Our repair workstation was therefore designed to accommodate any faults that occur after remelting for all component types used in the production.

The repair workstation is equipped with a Pace PRC 2000 soldering station, which enables the soldering and unsoldering of components by direct contact with soldering pads or contact-free using a hot-air tool. For mechanical modifying of substrates, the device is equipped with an adjustable cutter. It is also equipped with a dispersion and vacuum unit. For repairing and independent mounting of BGA cases we use a Pace station, type TF 2000, with an optical prism, hot-air tube with replaceable nozzles and temperature/soldering time regulator. For repairing and soldering terminated components, all workstations are equipped with small MBT 250 stations, with flux feeding and an electronic suction system.