• automat capacity: 4000 parts/hour
  
• semi-automat capacity: 300 parts/hour
  
• placement accuracy:
  
  • automat - optical: 0.025 mm
    
  • automat - mechanical: 0.07 mm
    
  • semi-automat - mechanical: 0.1 mm
    
• dimensions of mounted boards: 50 mm x 50 mm to 200 mm x 300 mm
  
• thickness of mounted boards: 0.5 mm - 2 mm
  
• size of mounted components: from 0402 to 51 mm x 51 mm, BGA cases up to terminal spacing of 0.5 mm
  
  

Automatic optical inspection

• board dimensions: 10 mm x 20 mm to 450 mm x 400 mm
  
• viewing field: 20.4 mm x 15.3 mm
  
• resolution: 15.9 µm/pixel
  
• inspection rate: 1.030 m2/s
• size of inspected components: from 0402 to 51 mm x 51 mm, IO up to terminal spacing of 0.4 mm
  
  

Inspection of X-RAY BGA cases

• magnification: 7 - 40x (fault recognition down to 0.025 mm)
  
• viewing field: d = 25 mm
  
• board dimensions: 300 mm x 300 mm
  
  

Component placement, soldering an BGA repairs using TF 2000 workstation

• board dimensions: 360 mm x 430 mm
  
• placement accuracy: 25 µm
  
• case dimensions: BGA, CSP up to 50 mm x 50 mm
  
• pre-heating: IR
  
• soldering: convective